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High-k Dielectric Materials

High-k dielectric materials are highly reactive and reactive precursors suitable for the Atomic Layer Deposition process of high-k metal oxide films.
High-k dielectric films are effective gate oxide & capacitor dielectric precursors for Memory and Logic Device Applications.

TMA

TMA
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TMA

Physical Characteristics
  • Chemical nameAluminum, trimethyl-
  • CAS No75-24-1
  • Molecular Weight72.1 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point125℃
  • Viscosity0.9 cP at 30℃
TMA
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TiO2

TiO2
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TiO2

Physical Characteristics
  • Chemical nameTrimethoxy[(1,2,3,4,5-η)-1,2,3,4,5-pentamethyl-2,4-cyclopentadien-1-yl]titanium
  • CAS No123927-75-3
  • Molecular Weight276.21 g/mol
  • AppreanceLiquid
  • ColorPale yellow
  • Boiling point285 ° C (at 760 mmHg)
  • Viscosity12.7 cP(at 25 °C )
TiO2
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TEMAZr

TEMAZr
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TEMAZr

Physical Characteristics
  • Chemical nameZirconium tetra(ethylmethylamide)
  • CAS No175923-04-3
  • Molecular Weight323.63 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point378.7℃
  • Viscosity3.4 cP(27℃)
TEMAZr
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CpZr

CpZr
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CpZr

Physical Characteristics
  • Chemical nameZirconium, (.eta.5-2,4-cyclopentadien-1-yl) tris(N-methylmethanaminato)-
  • CAS No33271-88-4
  • Molecular Weight288.55 g/mol
  • AppreanceLiquid
  • Colorpale yellow
  • Boiling point311℃
  • Viscosity7.24 mm2/s at 25℃
CpZr
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PCpZr

PCpZr
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PCpZr

Physical Characteristics
  • Chemical nameTris(N-methylmethanaminato)[(1,2,3,4,5-η)-1-propyl-2,4-cyclopentadien-1-yl]zirconium
  • CAS No2192174-63-1
  • Molecular Weight330.63 g/mol
  • AppreanceLiquid
  • Colorpale yellow
  • Boiling point254 ℃(101.3 kPa)
  • Viscosity7.21 cP (at 25℃)
PCpZr
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HfCl4

HfCl4
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HfCl4

Physical Characteristics
  • Chemical nameHafnium tetrachloride
  • CAS No13499-05-3
  • Molecular Weight320.3 g/mol
  • AppreanceSolid(Powder)
  • Colorwhite, orange
  • Boiling pointNot available
  • Vapour pressure1 ㎜Hg (at 190℃(sublimate))
  • Viscosity0.64 cP (131 ℃)
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TDMAHf

TDMAHf
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TDMAHf

Physical Characteristics
  • Chemical nameN-Methylmethanamine,hafnium(4+)salt (4:1)
  • CAS No19782-68-4
  • Molecular Weight354.79 g/mol
  • AppreanceSolid
  • ColorNot available
  • Melting point26 ~29 ℃
  • Boiling point60 °C at 0.01 hPa
  • ViscosityNot available
TDMAHf
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TEMAHf

TEMAHf
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TEMAHf

Physical Characteristics
  • Chemical nameN-Methylethanamine,hafnium(4+)salt
  • CAS No352535-01-4
  • Molecular Weight410.9 g/mol
  • AppreanceLiquid
  • Colorpale yellow
  • Boiling point63 ° C (at 0.1 mmHg)
  • Viscosity4.4 cP (at 21.76℃)
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CpHf

CpHf
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CpHf

Physical Characteristics
  • Chemical name(η5-2,4-Cyclopentadien-1-yl)tris(N-methylmethanaminato)hafnium
  • CAS No941596-80-1
  • Molecular Weight375.81 g/mol
  • AppreanceLiquid
  • Colorpale yellow
  • Boiling point300.4℃
  • Viscosity8.2 cP at 25 ℃
CpHf
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ZOA801

ZOA801
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ZOA801

Physical Characteristics
  • Chemical nameTetrahydrofuran
  • CAS No109-99-9
  • Molecular Weight72.1 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point65.4℃
  • Viscosity0.53 cP (20 ℃)
ZOA801
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Dielectric

Si is the most commonly-used element in semiconductor industry, and silicon containing materials are used in
various parts of semiconductor devices. Silicon-containing films such as insulating layer, etch stopper, hard mask, spacer and
double patterning dielectrics, require high quility conformal deposition process at low thermal buget.

BDEAS

BDEAS
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BDEAS

Physical Characteristics
  • Chemical nameBis(diethylamino)silane
  • CAS No27804-64-4
  • Molecular Weight174.36 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point188℃
  • Viscosity0.82cp
BDEAS
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BTBAS

BTBAS
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BTBAS

Physical Characteristics
  • Chemical nameN,N'-Bis(1,1-dimethylethyl)silanediamine
  • CAS No186598-40-3
  • Molecular Weight174.36 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point166℃
  • ViscosityNot available
BTBAS
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DIPAS

DIPAS
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DIPAS

Physical Characteristics
  • Chemical nameN,N-Bis(1-methylethyl)silanamine
  • CAS No908831-34-5
  • Molecular Weight131.3 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point116.9℃
  • ViscosityNot available
DIPAS
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HCDS

HCDS
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HCDS

Physical Characteristics
  • Chemical nameHexachlorodisilane
  • CAS No13465-77-5
  • Molecular Weight268.83 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point145.5℃
  • Viscosity1.65mPa.s
HCDS
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3DMAS

3DMAS
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3DMAS

Physical Characteristics
  • Chemical nameN,N,N`,N`,N``,N``-Hexamethylsilanetriamine
  • CAS No15112-89-7
  • Molecular Weight161.32 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point142℃
  • ViscosityNot available
3DMAS
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4MS

4MS
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4MS

Physical Characteristics
  • Chemical nameTetramethylsilane
  • CAS No75-76-3
  • Molecular Weight88.23 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point26.6℃
  • Viscosity0.23 cSt at 25 °C
4MS
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TEOS

TEOS
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TEOS

Physical Characteristics
  • Chemical nameTetraethoxy silane
  • CAS No78-10-4
  • Molecular Weight208.3 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point168.8℃
  • Viscosity0.6 cP (25℃)
TEOS
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SiCl4

SiCl4
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SiCl4

Physical Characteristics
  • Chemical nameSilicon tetrachloride
  • CAS No10026-04-7
  • Molecular Weight169.9 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point57.6 °C - lit.
  • ViscosityNot available
SiCl4
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DIS

DIS
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DIS

Physical Characteristics
  • Chemical nameDiiodosilane
  • CAS No13760-02-6
  • Molecular Weight283.91 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point149℃ ~ 150℃
  • ViscosityNot available
DIS
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BDMAMS

BDMAMS
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BDMAMS

Physical Characteristics
  • Chemical nameBis(dimethylamino)methylsilane
  • CAS No22705-33-5
  • Molecular Weight132.28 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point112~113℃
  • ViscosityNot available
BDMAMS
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TMDSO

TMDSO
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TMDSO

Physical Characteristics
  • Chemical name1,1,3,3-Tetramethyldisiloxane
  • CAS No3277-26-7
  • Molecular Weight134.3 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point72 ℃
  • Viscosity0.7 cSt (@ 25 °C)
TMDSO
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PYRIDINE

PYRIDINE
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PYRIDINE

Physical Characteristics
  • Chemical namePyridine
  • CAS No110-86-1
  • Molecular Weight79.1 g/mol
  • AppreanceLiquid
  • ColorColorless - Pale yellow
  • Boiling point115.5℃
  • Viscosity0.97 cP (20℃)
PYRIDINE
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Barrier & Metal

Transition metal & metal nitrides are widely used in technology because of their hardness,
stability at high temperature, chemical inertness and stability, electrical and optical properties.
These properties make them the materials of choice for diffusion barrier in microelecronic applications.

TiCl4

TiCl4
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TiCl4

Physical Characteristics
  • Chemical nameTitanium tetrachloride
  • CAS No7550-45-0
  • Molecular Weight189.69 g/mol
  • AppreanceLiquid
  • ColorColorless or yellow
  • Boiling point136.4℃
  • Viscosity0.8 mPa · s (dynamic) at 20 ℃
TiCl4
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CCTBA

CCTBA
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CCTBA

Physical Characteristics
  • Chemical nameHexacarbonyl (3,3-dimethyl-1-butyne)dicobalt
  • CAS No56792-69-9
  • Molecular Weight368.07 g/mol
  • AppreanceLiquid
  • ColorDeep Red
  • Boiling point52 ° C (at 0.08 mmHg)
  • ViscosityNot available
CCTBA
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CpCo(CO)2

CpCo(CO)2
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CpCo(CO)2

Physical Characteristics
  • Chemical namedicarbonyl(eta5-2,4-cyclopentadien-1-yl)cobalt
  • CAS No12078-25-0
  • Molecular Weight180.05 g/mol
  • AppreanceLiquid
  • ColorNot available
  • Boiling point140℃
  • ViscosityNot available
CpCo(CO)2
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Process Chemical

UP Chemical can serve special process & cleaning chemical for semiconductor and display industry.

OCTANE

OCTANE
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OCTANE

Physical Characteristics
  • Chemical nameOctane
  • CAS No111-65-9
  • Molecular Weight114.23 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point126℃
  • Viscosity0.52 cP at 25℃
OCTANE
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Coataid-20

Coataid-20
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Coataid-20

Physical Characteristics
  • Chemical nameSolvent naphtha (petroleum), heavyarom.
  • CAS No64742-94-5
  • Molecular WeightNot available
  • AppreanceLiquid
  • ColorColorless
  • Boiling point175℃ ~ 215℃
  • Viscosity0.88 cst(20℃)
Coataid-20
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Encapsulation for Display

Organic light-emitting diodes (OLDEs) are becoming more important for use in flexible displays.
However, the organic materials used in OLED displays are very sensitive to water vapor and oxygen.
Making it important to develop a thin-film encapsulation layer suitable for flexible displays.

TMA

TMA
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TMA

Physical Characteristics
  • Chemical nameAluminum, trimethyl-
  • CAS No75-24-1
  • Molecular Weight72.1 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point125℃
  • Viscosity0.9 cP at 30℃
TMA
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DIPAS

DIPAS
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DIPAS

Physical Characteristics
  • Chemical nameN,N-Bis(1-methylethyl)silanamine
  • CAS No908831-34-5
  • Molecular Weight131.3 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point116.9℃
  • ViscosityNot available
DIPAS
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BTBAS

BTBAS
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BTBAS

Physical Characteristics
  • Chemical nameN,N'-Bis(1,1-dimethylethyl)silanediamine
  • CAS No186598-40-3
  • Molecular Weight174.36 g/mol
  • AppreanceLiquid
  • ColorColorless
  • Boiling point166℃
  • ViscosityNot available
BTBAS
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