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Home> Product > Categorize by use > For semiconductor > Metallization

(hfac)Cu(DMB) [Cu29-002]

Physical Characteristics
Chemical Name (Hexafloroaceticaceto)(Tertiary-buteno) Copper
Formula Cu(CF3COCHCOCF3)[CH2CHC(CH3)3]
Molecular Weight 354.76
Boiling Point 61¡É/0.1torr
Density 1.40
Phase at 25 ¡É Deep blue liquid
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